Gallium-based liquid metal, as a high-performance thermal interface material, can improve the performance and service life of electronic equipment. This study focuses on the use of diamond as a thermal conductivity enhancement phase to improve the thermal conductivity of GaInSn liquid metal and avoid the overflow of liquid metal during application. In this study, diamond/GaInSn composites were prepared by an ultrasonic-assisted wetting method. The thermal conductivity and contact thermal resistance of diamond/GaInSn composites were characterized by the transient method. The morphology and thermal conductivity of diamond/GaInSn composites were investigated when diamond particles of different diameters were added to GaInSn liquid metal. The addition of large-sized diamond particles can effectively improve the thermal conductivity of thermal interface materials (TIMs) but will cause liquid metal to pump out. The material reaches a maximum thermal conductivity of 74 W·mK−1 with an added diamond particle size of 120 μm. The equilibrium mechanism between the thermal properties and pum** blockage performance in diamond/GaInSn with different diamond sizes is discussed in this article. The variation in thermal resistance of diamond/GaInSn composites is inconsistent with the variation in thermal conductivity. When the diamond size is 18 μm (800 mesh), the TIM has the lowest thermal resistance and the best heat transfer performance.
Graphical abstract
摘要
镓基液态金属作为一种高性能的热界面材料(TIM), 可以提高电子设备的性能并延长使用寿命. 本研究的重点是利用金刚石作为导热增**相, 提高GaInSn液态金属的导热性, 同时避免使用过程中液态金属的溢出. 本研究采用超声辅助润湿法制备了金刚石/GaInSn复合材料. 采用瞬态法对金刚石/GaInSn复合材料的导热系数和接触热阻进行了表征. 研究了不同粒径的金刚石颗粒加入到GaInSn液态金属中时金刚石/GaInSn复合材料的形貌和导热性能. 大尺寸金刚石颗粒的加入可以有效提高热界面材料的导热性, 但会引起液态金属的泵出. 当金刚石粒径增加到120 μm时, 材料的导热系数最高可达74 W·mK−1. 讨论了不同尺寸的金刚石/GaInSn热性能与泵出阻塞性能之间的**衡机理. 金刚石/GaInSn复合材料热阻的变化区别于导热系数的变化规律. 当金刚石尺寸为18 μm (800目)时, TIM的热阻最小, 传热性能最佳.
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This study was financially supported by Bei**g Natural Science Foundation (No. 2224105) and the Science and Technology Innovation Fund of GRINM (No. 12366).
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Du, SJ., Guo, H., **e, ZN. et al. Unveiling thermal properties and pump-out blocking in diamond/GaInSn composites as thermal interface materials. Rare Met. 42, 3969–3976 (2023). https://doi.org/10.1007/s12598-023-02331-y
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DOI: https://doi.org/10.1007/s12598-023-02331-y